Ultrasonic Fingerprint Identification Apparatus and Lamination Thickness Adjustment Method Therefor, and Electronic Device
AssigneeHuike (Singapore) Holding Pte.Ltd.
InventorCanhong Du
Life of this patent
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AssigneeHuike (Singapore) Holding Pte.Ltd.
InventorCanhong Du
Estimating the term…
Embodiments of the present disclosure provide an ultrasonic fingerprint identification apparatus and a lamination thickness adjustment method therefor, and an electronic device, and relate to the technical field of fingerprint identification. A specific embodiment of the ultrasonic fingerprint identification apparatus comprises: an integrated chip and a piezoelectric transducer, wherein a back surface of the integrated chip is connected to an application layer, and the piezoelectric transducer is located on a surface of the integrated chip. Through excitation of a driving pulse, the piezoelectric transducer transmits an ultrasonic signal to the application layer through the integrated chip, and a signal receiving circuit of the integrated chip receives an ultrasonic echo signal returned from a finger through the application layer. The embodiment can avoid an interference effect of surface defects of a lamination on fingerprint imaging, and improve accuracy of fingerprint identification.
An ultrasonic fingerprint identification apparatus, comprising:
Dependencies are inferred from the claim text.