Methods of determining an acceptable level of variation in the placement of an electronic component in connection with a semiconductor package, and related methods

Abstract

A method of determining an acceptable level of variation in the placement of an electronic component in connection with a semiconductor package is provided. The method includes the steps of: (a) providing package data for a semiconductor package, the semiconductor package including an electronic component; (b) simulating placement of the electronic component in a plurality of positions with respect to a substrate of the semiconductor package; and (c) determining an acceptable level of variation in at least one of shift and rotation of the electronic component with respect to the substrate.

Dependencies are inferred from the claim text.