Repair instruction device and repair instruction method
AssigneeHitachi, Ltd.
InventorsMasahiro ITOH, Masanori MIYAGI, Katsumi MABUCHI, Toshinori KAWAMURA, Tsutomu NOZAKI, Masahiro WATANABE
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AssigneeHitachi, Ltd.
InventorsMasahiro ITOH, Masanori MIYAGI, Katsumi MABUCHI, Toshinori KAWAMURA, Tsutomu NOZAKI, Masahiro WATANABE
Estimating the term…
A repair instruction device is provided with a target plating thickness determination unit configured to determine a target plating thickness, which is a target of a plating thickness to be applied to a repair object having a repaired portion by a plating application unit, based on a measured shape, which is a result of measuring a shape of the repair object; and a plating condition determination unit configured to determine, as plating conditions, a thickness of the plating gel material to be attached to the repair object and/or a value of a current flowing through the plating gel material via a plating electrode, based on the calculated target plating thickness.
A repair instruction device comprising:
A repair instruction device comprising:
A repair instruction method comprising:
Dependencies are inferred from the claim text.