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AssigneeAisin Corporation
InventorsNoriaki SUGIMOTO, Takuya KATSUDA, Daiki SUYAMA, Shinya YOSHIMURA, Yuki NAGAI, Hirokazu HIRAYAMA, Hidefumi KOASHI, Keisuke TAKEMOTO, Keita MUTSUURA, Kenta GOTO
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A power supply module includes a cooling case facing a plurality of electronic components that generate different amounts of heat. The cooling case is provided inside with a channel through which a cooling fluid flows. The cooling case includes a first portion facing the electronic component that generates a relatively large amount of heat, and a second portion facing the electronic component that generates a relatively small amount of heat. The second portion has a lower thermal conductivity than the first portion.
A power supply module comprising a cooling case facing a plurality of electronic components that generates different amounts of heat, and provided inside with a channel through which a cooling fluid flows, wherein the cooling case includes
Dependencies are inferred from the claim text.