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AssigneeHuawei Technologies Co., Ltd.
InventorXianfu Zhang
Estimating the term…
A processing and switching die, a communication chip, a data processing apparatus, and a method are disclosed, and relate to the field of communication technologies, to greatly reduce a quantity of processing units in a device, reduce device costs, improve device energy efficiency, and reduce heat dissipation and power supply costs and deployment space. A communication chip is provided. The communication chip includes a processing and switching die and a plurality of network processing dies coupled to the processing and switching die. The processing and switching die includes at least one processing unit and a plurality of switching units. The at least one processing unit is configured to: control and manage the plurality of switching units and the plurality of network processing dies. The plurality of network processing dies are configured to provide capabilities such as a network interface and network processing.
A processing and switching die, wherein the processing and switching die is configured to be coupled to a plurality of network processing dies;
A communication chip, wherein the communication chip comprises at least one processing and switching die and a plurality of network processing dies coupled to the at least one processing and switching die, and the at least one processing and switching die is the processing and switching die, wherein the processing and switching die comprises at least one processing unit and a plurality of switching units, and the at least one processing unit is configured to:
A control and management method, applied to a communication chip, wherein the communication chip comprises a processing and switching die and a plurality of network processing dies coupled to the processing and switching die, the processing and switching die comprises at least one processing unit and a plurality of switching units, and the method comprises:
Dependencies are inferred from the claim text.