Pin for transfer molded semiconductor device package

An apparatus, comprising:

• a base;
• a tip;
• a body region disposed between the base and the tip, the body region having a cylindrical shape;
• and
• a flange disposed on a top of a deformable moving component that is configured to slide on the body region,
• the deformable moving component in a deformed state being in a fixed position to bias the flange upward against a surface.

A power circuit comprising:

• a chip assembly disposed on a top surface of a direct bond metal (DBM) substrate;
• a first metal strip having a first end extending beyond a first edge of the DBM substrate as a negative direct current power terminal disposed at the first edge, the first metal strip having multiple parallel extensions extending from the first edge to respective second ends attached to the DBM substrate;
• a second metal strip having a first end extending beyond the first edge of the DBM substrate as a positive direct current power terminal disposed at the first edge, the second metal strip having multiple parallel extensions extending from the first edge to respective second ends attached to the DBM substrate;
• and
• a third metal strip having a first end extending beyond a second edge of the DBM substrate, opposite the first edge, as an alternating current power terminal disposed at the second edge, the third metal strip having multiple parallel extensions extending from the second edge to respective second ends attached to the DBM substrate,
• the first, second, and third metal strips confining current in the power circuit to flow in parallel paths along the respective multiple parallel extensions.

A method comprising:

• inserting a pin in an opening in a mold cavity block in a mold chase;
• sliding a flange over a body region of the pin;
• and
• biasing the flange against a surface of the mold cavity block surrounding the opening therein.

A method comprising:

• disposing a chip assembly and components on a direct bond metal (DBM) substrate to form a power circuit;
• disposing metal strips on the power circuit, the metal strips having first ends that extend beyond edges of DBM substrate to serve as external terminals of the power circuit when encapsulated in a molded package, each metal strip having multiple parallel extensions with respective second ends;
• attaching the respective second ends of the metal strips to the DBM substrate;
• attaching a signal pin in a vertical orientation to a trace on the DBM substrate, the signal pin including a flange attached to a top of a moving component sliding on a body region of the signal pin;
• disposing the DBM substrate on which the power circuit is formed on a top of a bottom mold cavity in a mold cavity chase;
• disposing a top cavity block on top of the DBM substrate to form a top mold cavity;
• aligning and inserting the signal pin in an opening extending through the top cavity block;
• biasing a flange attached to a top of the moving component to press against a surface of the top cavity block;
• injecting fluid mold material in at least the top mold cavity;
• and
• after the fluid mold material is cured and set, removing the top cavity block.