Silver particles

Abstract

A method for producing an electronic part in which members are bonded with a sintered body, including: placing a conductive adhesive between the members; and sintering the conductive adhesive at a temperature of 250° C. or less to form the sintered body and bond the members with the sintered body, wherein the conductive adhesive includes silver particles and a solvent, wherein the silver particles include: silver particles A having an average particle diameter in a range of 50 to 500 nm; and silver particles B having an average particle diameter in a range of 0.5 to 5.5 μm, wherein an average particle diameter of the silver particles B is 5 to 11 times an average particle diameter of the silver particles A.

Dependencies are inferred from the claim text.