Polishing solution and surface treatment method

Abstract

Provided in the present application are a polishing solution and a surface treatment method. The method comprises: using a polishing solution to act on a substrate having a surface bonded to a first polymer, so as to remove the first polymer on at least part of the surface of the substrate, wherein the polishing solution comprises a polishing material, and the polishing material is selected from at least one of a second polymer and an inorganic nanomaterial. Using the surface treatment method of the present application can effectively polish the soft material on the surface of the substrate, thus avoiding damages or corrosion to the substrate, reducing abrasive residues, having easy and convenient operation and low costs, and being suitable for wide use.

Dependencies are inferred from the claim text.