Application system having a transfer belt

An application system for applying a multiplicity of adhesive elements to substrates to be bonded, comprising:

• a) a dispenser device comprising:
• a1) two or more dispenser units, wherein each dispenser unit comprises a multiplicity of adhesive elements or at least an adhesive element precursor, wherein the two or more dispenser units are configured to deliver one or more adhesive elements,
• a2) an adhesive element guiding system, and
• a3) a transfer unit comprising a conveyor belt having a reduced-adhesion surface and a dispensing edge,
• wherein the dispenser device is configured to transfer one or more adhesive elements delivered from the dispenser units to the conveyor belt of the transfer unit by way of the adhesive element guiding system, and to hereby generate, on the reduced-adhesion surface, an adhesive element arrangement from one or more adhesive elements, wherein the adhesive element arrangement comprises the one or more adhesive elements from different dispenser units,
• and
• b) an application device spaced apart from the dispenser device and is disposed on an automated motion unit, the application device comprising:
• b1) a conveyor element comprising a conveyor belt having a reduced-adhesion surface, that extends through a receiving region, a retrieving region, and a reservoir region, and
• b2) an application element,
• wherein the application device is configured such that a multiplicity of adhesive elements, that have been applied to the reduced-adhesion surface in the receiving region, are movable into the reservoir region by way of the conveyor element and that at least one adhesive element of the multiplicity of adhesive elements located in the reservoir region is movable into the retrieving region by way of the conveyor element,
• wherein the application device is configured to receive an adhesive element disposed on the conveyor belt of the conveyor element in the retrieving region by way of the application element and to apply the adhesive element to a substrate to be bonded,
• wherein the application system is configured such that the application device is movable relative to the dispenser device to a transfer position by way of the automated motion unit, in which transfer position the application system is configured such that the adhesive elements of the adhesive element arrangement is movable over the dispensing edge onto the conveyor element by the transfer unit and in the receiving region be applied to the reduced-adhesion surface of the conveyor element such that at least part of the transferred adhesive elements is conveyed into the reservoir region by way of the conveyor element, and
• wherein the application system is configured to, after transferring the adhesive elements of the adhesive element arrangement onto the conveyor element, in an application mode, convey adhesive elements from the reservoir region into the retrieving region, to receive the adhesive elements by way of the application element and to apply the adhesive elements to a substrate to be bonded.