US 2026/0216842 A1 · POLISHING APPARATUS AND POLISHING METHOD

Abstract

A polishing apparatus capable of accurately determining a position of a measurement point of a film thickness of a workpiece is disclosed. The polishing apparatus includes: a polishing head configured to press a workpiece against a polishing pad on a polishing table to polish the workpiece; a film-thickness sensor configured to measure a film thickness at a measurement point on a surface of the workpiece; an infrared imaging device configured to generate a first image and a second image of a feature region on the surface of the workpiece at a predetermined time interval through a back surface of the workpiece; and a processing controller configured to determine coordinates of the measurement point on the surface of the workpiece based on the first image and the second image.

Claims20

Dependent claims

A polishing apparatus comprising:

a polishing table configured to support a polishing pad;
a polishing head configured to press a workpiece against the polishing pad on the polishing table to polish the workpiece, the workpiece having a surface on which a feature region is formed;
a polishing-head motor configured to rotate the polishing head;
a film-thickness sensor fixed to the polishing table and configured to measure a film thickness at a measurement point on the surface of the workpiece;
an infrared imaging device arranged in the polishing head and configured to generate a first image and a second image of the feature region on the surface of the workpiece at a predetermined time interval through a back surface of the workpiece;
and
a processing controller configured to determine coordinates of the measurement point on the surface of the workpiece based on the first image and the second image.

4 more elements

A polishing method comprising:

polishing a workpiece by pressing the workpiece against a polishing pad on a polishing table with a polishing head while rotating the polishing head, the workpiece having a surface on which a feature region is formed;
during polishing of the workpiece, generating a first image and a second image of the feature region on the surface of the workpiece at a predetermined time interval through a back surface of the workpiece by an infrared imaging device arranged in the polishing head;
during polishing of the workpiece, measuring a film thickness at a measurement point on the surface of the workpiece by a film-thickness sensor fixed to the polishing table;
and
determining coordinates of the measurement point on the surface of the workpiece based on the first image and the second image.

2 more elements

Dependencies are inferred from the claim text.

Polishing apparatus and polishing method

Life of this patent

Polishing apparatus and polishing method

Life of this patent

Abstract

Claims20