A method for cleaning pot-shaped hollow bodies for semiconductor wafers or for lithography masks, comprising:
- providing a hollow body to be cleaned, the hollow body comprising one or more side walls that define an inner hollow body surface and an opening that is enclosed by the side wall, and
- providing a cleaning device with a first dispensing unit by which a first cleaning fluid and a second cleaning fluid for cleaning the inner hollow body surface can be dispensed, and a first drainage channel through which the first cleaning fluid and the second cleaning fluid dispensed by the cleaning device can be drained;
- dispensing of the first cleaning fluid for cleaning the inner hollow body surface by the first dispensing unit;
- draining the first cleaning fluid by the first drainage channel, wherein the first cleaning fluid has a first surface tension;
- dispensing of the second cleaning fluid for cleaning the inner hollow body surface by the first dispensing unit, wherein the second cleaning fluid is miscible with the first cleaning fluid and the mixture so generated by the first cleaning fluid and the second cleaning fluid has a mixture surface tension that is lower than the first surface tension;
- and
- draining the mixture through the first drainage channel or through a further drainage channel.