Substrate separation apparatus

Abstract

A substrate separation apparatus, includes: a holding part configured to hold both surfaces of a bonded substrate formed by bonding a pair of substrates together; a rotational drive part configured to rotate the holding part; a nozzle configured to separate the bonded substrate by injecting a fluid toward an outer periphery of the bonded substrate under rotation; a nozzle movement part configured to move the nozzle; an imaging part configured to capture an image of an outer circumferential surface of the bonded substrate held by the holding part; and a control device configured to control the nozzle movement part, wherein the control device is configured to control the nozzle movement part to align a position of the nozzle with a position of a separation surface of the bonded substrate detected from the image captured by the imaging part.

Dependencies are inferred from the claim text.