Communication device

Abstract

A communication device is provided. The communication device comprises a radio frequency (RF) circuit board, a first antenna structure, a second antenna structure, and a heat dissipation structure. The first antenna structure and the second antenna structure are both electrically connected to the RF circuit board. The first antenna structure is separated from the second antenna structure. The heat dissipation structure is stacked with the RF circuit board and the first antenna structure along a longitudinal direction. The heat dissipation structure is disposed between the first antenna structure and the RF circuit board in the longitudinal direction.

Dependencies are inferred from the claim text.