High-throughput load lock chamber
AssigneeASML Netherlands B.V.
InventorsDongchi YU, Yi-Chen LIN, Shao-Wei FU, Jun-li LIN, Huan-Yu CHANG
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Abstract
An improved vacuum chamber for a system handling a wafer is provided. The vacuum chamber may comprise a top wall wherein at least a portion of an interior surface of the top wall is slanted relative to a side view of the top wall. The vacuum chamber may further comprise a gas vent port coupled to the top wall and a baffle coupled to the vacuum chamber and positioned below the gas vent port, wherein the baffle is configured to reduce turbulence of gas that enters the vacuum chamber via the gas vent port.
Claims20
A vacuum chamber for a system configured to handle a wafer, comprising:
- a top wall wherein at least a portion of an interior surface of the top wall is slanted relative to a side view of the top wall;
- a gas vent port coupled to the top wall;
- and
- a baffle coupled to the vacuum chamber and positioned below the gas vent port, wherein the baffle is configured to reduce turbulence of gas that enters the vacuum chamber via the gas vent port.
A vacuum chamber comprising:
- a top wall having an interior surface facing towards an inside of the vacuum chamber;
- and
- a gas vent port coupled to the top wall and configured to provide gas into the vacuum chamber;
- wherein at least a portion of the interior surface of the top wall is sloped away at a downward angle from a position of the gas vent port and the vacuum chamber is configured to receive a wafer and hold the wafer on a wafer stage.
Dependencies are inferred from the claim text.