Substrate processing method or system for the method, and a semiconductor device production method

A substrate processing system comprising:

• a first chamber configured to perform a self-assembled monolayer treatment;
• wherein the first chamber comprises a body, a substrate holder, and a heating evaporator;
• the heating evaporator comprises a porous medium that is configured to be impregnated with an organic inhibitor compound and a heating element;
• and
• wherein the heating evaporator is disposed inside the body or disposed outside the body and connected to the body.

A method of manufacturing a semiconductor device comprising:

• forming a dielectric layer on a substrate;
• and
• selectively depositing one or more atomic layers on the dielectric layer,
• wherein depositing the one or more atomic layers comprises:
• evaporating, under a pressure below atmospheric pressure, an organic inhibitor compound from an organic inhibitor compound-impregnated porous medium to provide an evaporated organic inhibitor compound;
• and
• selectively depositing the evaporated organic inhibitor compound onto a first region of the substrate under a first pressure in a first chamber including the substrate, for a predetermined time, to form a self-assembled monolayer including the organic inhibitor compound on the first region of the substrate.