Substrate assembly with test interface to configure onboard circuitry

Abstract

A layered assembly as discussed herein can be configured to include a circuit substrate and a test interface. The circuit substrate can be configured to include a first circuit substrate portion and a second circuit substrate portion; the first circuit substrate portion including first circuitry. The test interface can be configured to include at least one electrically conductive path extending between the second circuit substrate portion and the first circuit substrate portion, where the at least one electrically conductive path supports configuration of the first circuitry. Sometime subsequent to configuring the first circuitry, a fabricator resource can be configured to physically partition the first circuit substrate portion and the second circuit substrate portion, resulting in severing of the at least one electrically conductive path.

Dependencies are inferred from the claim text.