Circuit assembly and device with radio frequency contacts

A circuit assembly, comprising:

• a packaged electronic device having a radio frequency (RF) contact and a shield contact;
• a substrate coupled to the packaged electronic device and at least partially containing an inner conductive structure electrically coupled to the RF contact and an outer conductive structure electrically coupled to the shield contact, the inner conductive structure and the outer conductive structure forming a vertical coaxial structure through the substrate;
• and
• a waveguide antenna electrically coupled to the coaxial structure on a side of the substrate opposite the packaged electronic device.

A packaged electronic device, comprising:

• an integrated circuit that includes an RF signal node and a shield node;
• a package that contains the integrated circuit, the package having a surface;
• a plurality of electrical contacts at the surface;
• and
• an RF pin coupled to the surface, wherein the RF pin is electrically coupled to the RF signal node and extends farther outward from the surface than the plurality of electrical contacts, and
• wherein the plurality of electrical contacts include at least one contact electrically coupled to the shield node and disposed immediately adjacent to the RF pin.