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US 2026/0193492 A1Published application
Multi-layer adhesive film, preparation method and use thereof
AssigneeHenkel AG & Co. KGaA
InventorsDongmei Shen, Yizhong Luo, Bingbing Guo
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Abstract
The present invention provides a multi-layer adhesive film, preparation method, and use thereof. In particular, disclosed herein is a multi-layer adhesive film that exhibits excellent impact resistance, good bonding strength and outstanding rework ability when cured at a low temperature, such as no more than 90° C.
Claims14
A multi-layer adhesive film comprising:
- a first layer having a first major surface and a second major surface opposite the first major surface, and
- a second layer disposed on the first major surface of the heat-activated adhesive film;
- wherein the first layer is a heat-activated adhesive film prepared by drying a solvent-based heat-activated adhesive composition (A) until the solvent content is no more than 5% by weight of the total solvent-based heat-activated adhesive composition, and the solvent-based heat-activated adhesive composition (A) comprises at least one thermoplastic polymer (A1), at least one polyol (A2), at least one polyisocyanate having at least two isocyanate groups and at least one uretdione group in one molecule (A3) and an organic solvent (A4);
- wherein the second layer is derived from a dispersion composition (B) comprising at least one water-based polyurethane dispersion (B1) and optionally a latent curing agent (B2).
1 more element
The multi-layer adhesive film according to claim 8, wherein the water-based polyurethane dispersion (B1) has a weight molecular weight (Mw) of 50,000 g/mol to 80,000 g/mol.
Dependencies are inferred from the claim text.