Dust and temperature control in an active mems cooling system

Abstract

The present application discloses a cooling system. The cooling system is configured to modulate temperature of an electronic device. The cooling system comprises a cooling structure and a support structure thermally coupling the cooling structure to a heat-generating structure via thermal conduction. The cooling structure comprises (i) one or more walls defining an inner chamber, (ii) a cooling element, and (iii) a filtration subsystem. The one or more walls comprise one or more inlets, and one or more outlets. The cooling element is configured to drive a fluid from the one or more inlets to the one or more outlets. The filtration subsystem comprises a coarse filter and a fine filter, and the filtration subsystem is configured to remove contaminants introduced by fluid flowing through the one or more inlets.

Dependencies are inferred from the claim text.