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US 2026/0184972 A1Published application
Hot melt pressure-sensitive adhesive composition
AssigneeBostik SA
InventorsKanagaraj BASKAR, Rajesh CHIDAMBARAM, Abhishek BHUSHAN
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Abstract
The present invention relates to a hot melt pressure-sensitive adhesive composition comprising: —at least one styrene block copolymer (C); —a thermoplastic polyurethane; and —a tackifying resin; and its uses.
Claims18
1-19. (canceled)
A hot melt pressure-sensitive adhesive composition comprising:
- at least one styrene block copolymer (C);
- a thermoplastic polyurethane;
- and
- a tackifying resin.
1 more element
Dependencies are inferred from the claim text.