A polysiloxane composition
AssigneeWacker Chemie AG
InventorsJunshan Yin, Haigang KANG
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AssigneeWacker Chemie AG
InventorsJunshan Yin, Haigang KANG
Estimating the term…
The present invention relates to an organosilicon composition with low viscosity and thixotropic index under the condition of high filling rate, which contains vinyl silicone oil, heat conductive filler, silane compound and polysiloxane. The composition can be used in the technical field of thermally conductive materials. The present invention relates to an organosilicon composition with low viscosity and thixotropic index under the condition of high filling rate, which contains vinyl silicone oil, heat conductive filler, silane compound and polysiloxane. The composition can be used in the technical field of thermally conductive materials. The present invention relates to an organosilicon composition with low viscosity and thixotropic index under the condition of high filling rate, which contains vinyl silicone oil, heat conductive filler, silane compound and polysiloxane. The composition can be used in the technical field of thermally conductive materials.
1-11. (canceled)
A composition, which contains:
Dependencies are inferred from the claim text.