Low density organopolysiloxane foam with filler
AssigneesDow Silicones Corporation, Rohm and Haas Company
InventorsChi-Hao Chang, Craig F. Gorin, Michael Hartmann, Patrick Beyer, Bizhong Zhu, Hulusi Turgut, Nathaniel P. Stelzer, Wen-Shiue Young
Life of this patent
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Abstract
The present invention relates to a composition comprising a polyorganosiloxane foam interspersed with from 30 to 50 weight percent of a filler, wherein the foam has a density in the range of from 0.20 g/cm3 to 0.60 g/cm3. The composition of the present invention is useful as a thermal barrier for batter modules.
Claims7
A composition comprising a polyorganosiloxane foam interspersed with, based on the weight of the composition, from 30 to 50 weight percent of one or more fillers selected from the group consisting of metals, metal oxides, metal hydroxides, metal acetates, metal carbides, metal oxycarbides, metal carbonates, metal bicarbonates, metal hydroxycarbonates, metal nitrides, metal nitrates, metal sulfates, metal chlorides, metal silicides, metal silicates;
- wherein the foam has a density in the range of from 0.20 g/cm3 to 0.60 g/cm3 and the foam comprises Si—O—R′ groups and Si—X—R″ groups at a SiOR′:SiX—R″ ratio in the range of from 0.4:1 to 7:1, where each X is independently O or CH2CH2, O—R′ is a remnant of a blowing agent, and X—R″ is a remnant of a vinyl-substituted or an OH-substituted polyorganosiloxane.
Dependencies are inferred from the claim text.