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AssigneeShin-Etsu Chemical Co., Ltd.
InventorNorio KAMEDA
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In the present invention, a bonded member is obtained by bonding together a plurality of members, including a member in which at least a portion of a bonding interface is metal, by means of a cured product obtained by curing a curable silicone-based liquid adhesive agent, which contains 25-80 mass % of a hydroxide compound having a decomposition temperature of 180-600° C. and in which the content of a material for generating heat by electromagnetic induction is no more than 3 mass %. The bonded member exhibits sealing properties at room temperature and, moreover, it is possible to easily disassemble the bonded member in a short time and with little consumed energy, even after exposure to high temperatures of approximately 150° C., by heating the metal portion at the bonding interface of the bonded member by electromagnetic induction, and it is possible to recycle the disassembled member.
In conjunction with a joined assembly composed of a plurality of members including a member in which at least a portion of its bond interface is a metal, the members being bonded with a cured product obtained by curing a curable liquid silicone adhesive comprising 25 to 80% by weight of a hydroxide compound having a decomposition temperature of 180 to 600° C. and up to 3% by weight of a material capable of heat generation by electromagnetic induction,
Dependencies are inferred from the claim text.