Cable assembly and cable bypass assembly having the same

A cable bypass assembly comprising:

• a connector housing adapted for mating with a mating connector;
• and
• a first cable assembly and a second cable assembly received in the connector housing and arranged symmetrically in an up-down direction, the first cable assembly comprising:
• a first row of terminals arranged in a transverse direction perpendicular to the up-down direction, each of the first row of terminals having a plurality of contact portions and a plurality of tail portions, the first row of terminals comprising a plurality of pairs of first signal terminals for transmitting high-speed signals;
• a first shielding plate disposed on one side of the first row of terminals and integrally having a plurality of first ground contact portions aligned with the plurality of contact portions of the first row of terminals;
• and
• a plurality of first cables each including a pair of first signal conductors, a first insulative layer enclosing the pair of first signal conductors, and a first ground shield disposed outside the first insulative layer, the pair of first signal conductor terminated to the tail portions of a corresponding pair of first signal terminals, the first ground shield electrically connected to the first shielding plate.

A cable bypass assembly adapted for mating with a mating connector that is inserted into a device for electrically connecting the mating connector to a vicinity of a chip of the device, the cable bypass assembly comprising:

• a connector housing;
• a first cable assembly received in the connector housing;
• and
• a second cable assembly received in the connector housing and disposed opposite to the first cable assembly to form a mating area for mating with the mating connector, each of the first cable assembly and the second cable assembly including:
• a plurality of pairs of signal terminals arranged in a row, each signal terminal including a signal contact portion and a signal tail portion;
• an upper shielding plate disposed on an upper side of the row of signal terminals;
• a lower shielding plate disposed on a lower side of the row of signal terminals, at least one of the upper shielding plate and the lower shielding plate integrally having a plurality of ground contact portions aligned with the signal contact portions of the plurality of pairs of signal terminals;
• and
• a plurality of cables each comprising a pair of signal conductors, an insulative layer enclosing the pair of signal conductors, and a ground shield disposed outside the insulative layer, the ground shield and the signal conductors having opposed first and second free ends, the first free end of the signal conductors being electrically connected to the signal tail portions of a pairs of signal terminals, the first free end of the ground shield being electrically connected to at least one of the first shielding plate and the second shielding plate, and the second free ends of the ground shield and the signal conductors being electrically coupled to a vicinity of the chip within the device.