Seismic event displacement mitigation

An apparatus, comprising:

• an equipment support structure configured to support a semiconductor fabrication component, wherein the equipment support structure comprises:
• a first plate;
• a second plate;
• and
• a body extending between the first plate and the second plate and fixedly coupled to the first plate and the second plate;
• and
• a damper assembly configured to resist a lateral force induced by a seismic event to the equipment support structure, wherein the damper assembly comprises:
• a base plate having a curved upper surface facing the second plate and the first plate.

An apparatus, comprising:

• a damper assembly configured to resist a lateral force induced by a seismic event to an equipment support structure configured to support a semiconductor fabrication component, wherein:
• the damper assembly comprises:
• a base plate having a curved upper surface;
• a first damper body having a cylindrical shape and configured to rotate along the curved upper surface;
• and
• a second damper body having a cylindrical shape and configured to rotate along the curved upper surface, and
• a thickness of a lateral center of the base plate is less than a thickness of a first side edge of the base plate and a thickness of a second side edge of the base plate diametrically opposite the first side edge.