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AssigneesWaseda University, Adeka Corporation
InventorsChiharu TOKORO, Manabu INUTSUKA, Soonwon LIM, Taketoshi KOITA, Masataka KONDO, Ryo OGAWA, Keisuke OTA
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The present invention provides: a method of reducing an adhesive strength of an adhesion layer, the method including applying an electric pulse to an article including a portion in which two or more members are bonded to each other via an adhesion layer containing a conductive filler, to thereby reduce an adhesive strength of the adhesion layer; and a method of reusing a member or a functional part in the member, the method including removing the member from the article by using the above-mentioned method.
A method of reducing an adhesive strength of an adhesion layer, the method comprising applying an electric pulse to an article including a portion in which two or more members are bonded to each other via an adhesion layer containing a conductive filler, to thereby reduce an adhesive strength of the adhesion layer.
Dependencies are inferred from the claim text.