Substrate processing method and substrate processing apparatus

Abstract

The present application relates to a substrate processing method and a substrate processing apparatus for suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying a filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The method includes: measuring surface shapes of an edge portion of a first substrate and an edge portion of a second substrate; determining an applying condition for the filler to be applied to the laminated substrate based on results of the measuring of the surface shapes; and applying the filler to a gap between the edge portion of the first substrate and the edge portion of the second substrate of the laminated substrate under the determined applying condition.

Dependencies are inferred from the claim text.