Wafer transfer device, wafer loading and unloading device, and control method thereof

A wafer loading and unloading equipment, comprising:

• a wafer transfer device;
• a heat sink test device;
• and
• a wafer pick-up device,
• wherein the wafer transfer device is used for transferring a heat sink carrying a wafer and placing the heat sink carrying the wafer in a test chamber of a wafer-level burn-in test device or taking it out from the test chamber, the wafer transfer device includes a suction structure and a lifting structure capable of driving the suction structure to move vertically, the suction structure comprises:
• a first bracket being ring-shaped and connected to the lifting structure;
• a plurality of suction members arranged at intervals along a circumferential direction of the first bracket, connected to the first bracket, and configured to provide suction forces to a bottom of the wafer concurrently for attaching the wafer to the heat sink;
• and
• a plurality of snap-in parts arranged at intervals along the circumferential direction of the first bracket, connected to the first bracket, configured to be controlled to clamp the heat sink carrying the wafer concurrently, and providing suction forces on the heat sink to prevent the heat sink carrying the wafer from falling off while the heat sink moves with the suction structure in a movement,
• wherein the heat sink test device is provided beside the wafer transfer device and has a mounting platform for placing the heat sink, the mounting platform is configured to controllably extend out of the heat sink test device for the wafer transfer device to place the heat sink carrying the wafer on the mounting platform or take out the heat sink carrying the wafer from the mounting platform,
• wherein the wafer pick-up device is configured next to the heat sink test device, and arranged to take out the wafer from a wafer cassette, perform position calibration of the wafer, and then place the wafer on the heat sink at the mounting platform, and the wafer pick-up device is further configured to take the wafer on the heat sink and transfer the wafer to the wafer cassette.

A method for controlling a wafer loading and unloading equipment, comprising:

• after placing a heat sink carrying a target wafer on a mounting platform of a heat sink test device, controlling the mounting platform to extend laterally toward a wafer-level burn-in test device;
• controlling a suction structure to clamp the heat sink carrying the target wafer;
• after the mounting platform is controlled to reset, controlling a pressure-bearing platform of the wafer-level burn-in test device to extend laterally toward the heat sink test device;
• controlling the suction structure to place the heat sink carrying the target wafer in a lower sealing cover of the pressure-bearing platform;
• and
• after the pressure-bearing platform is controlled to reset, controlling the lower sealing cover to duck with a cover plate assembly to form a test chamber for wafer-level burn-in testing.