Method and system for adjusting groove profile for laser grooving
AssigneeZhejiang Darcet Technology Co, Ltd
InventorsJANE JIAYING SOH, Baishun GUO
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AssigneeZhejiang Darcet Technology Co, Ltd
InventorsJANE JIAYING SOH, Baishun GUO
Estimating the term…
The present disclosure relates to a method and system for adjusting a groove profile for laser grooving, aiming to improve the precision and efficiency of a laser grooving process, and is particularly suitable for the field of semiconductor manufacturing. According to the method, through steps of wafer identification, feature extraction, groove profile feature input, laser parameter setting, spot adjustment, grooving, and inspection, automated and intelligent adjustment of the laser grooving process is achieved, and the grooving quality and production efficiency are improved. By introducing advanced technologies such as a particle swarm optimization (PSO) algorithm and a convolutional neural network (CNN), the present disclosure not only can automatically optimize laser parameters to ensure high quality and consistency of a groove profile, but also can achieve precise adjustment of a spot and real-time detection and evaluation of the groove profile, thereby comprehensively improving the overall level of the laser grooving process.
A method for adjusting a groove profile for laser grooving, comprising:
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