Light-emitting diode package

Abstract

A light-emitting diode package is provided. The light-emitting diode package includes a light-emitting diode chip, a wavelength conversion layer, a dielectric layer, a distributed Bragg reflector layer, a conductive component, and a reflective layer. The light-emitting diode chip includes a light-emitting surface and a plurality of side surfaces. The wavelength conversion layer is disposed on the light-emitting surface of the light-emitting diode chip, and the wavelength conversion layer includes a plurality of side surfaces. The dielectric layer covers the side surfaces of the light-emitting diode chip. The distributed Bragg reflector layer is disposed below the light-emitting diode chip. The conductive component is disposed below the distributed Bragg reflector layer and electrically connected to the light-emitting diode chip through the distributed Bragg reflector layer. The reflective layer is disposed on the side surfaces of the wavelength conversion layer.

Dependencies are inferred from the claim text.