Integrated single-phase direct-to-chip cooling using r718

A cooling system comprising:

• an enclosure;
• a first condenser disposed at least partially within the enclosure and configured to condense a refrigerant;
• a compressor disposed at least partially within the enclosure and configured to selectively compress the refrigerant;
• an evaporator disposed at least partially within the enclosure and fluidically coupled to the first condenser;
• a first pump disposed at least partially within the enclosure and configured to selectively pump the refrigerant from the evaporator to a plurality of cold plates;
• a heat exchanger disposed at least partially within the enclosure and fluidically coupled to the first condenser;
• and
• a second pump disposed at least partially within the enclosure and configured to selectively pump the refrigerant from the first condenser to the heat exchanger or the evaporator.