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US 2026/0150974 A1Published application
Cutting and coupling method and system
OwnerRoberto TROVIinventor
Life of this patent
Estimating the term…
Abstract
Cutting and coupling method, including the steps of providing a first sheet of resilient material and moving it towards a first coupling area; providing a spring pack and moving it towards said first coupling area; gluing a contact surface of said first sheet to a first lateral surface of said spring pack and cutting a first portion of said first sheet glued to said spring pack, thereby obtaining a first spar.
Claims8
A cutting and coupling method, comprising the following steps in precise order:
- arranging a first sheet of resilient material;
- moving said first sheet of resilient material towards a first coupling area;
- providing a spring pack;
- moving said spring pack towards said first coupling area;
- gluing a contact surface of said first sheet to a first lateral surface of said spring pack;
- cutting a first portion of said first sheet glued to said spring pack, thus obtaining a first spar glued to said first lateral surface of said spring pack,
- said method being characterized by the fact that it includes a step of rotating said spring pack to glue at least one further spar onto said spring pack.
4 more elements
A cutting and coupling system, comprising:
- a first station designed to feed a sheet of resilient material to a first coupling area for at least partial assembly of a semi-finished product;
- a second station designed to feed a spring pack towards said first coupling area for at least partial assembly of said semi-finished product;
- gluing means arranged near said first coupling area and designed to apply an adhesive layer to at least one contact surface between said first sheet and said spring pack;
- a cutting device arranged in proximity to said first coupling area and designed to cut a portion of said first sheet of resilient material so as to obtain a first spar, said first spar being glued to said spring pack on a first lateral surface thereof,
- said system being characterized by the fact that it comprises a device for gripping and rotating said spring pack configured to rotate it at least on a second lateral surface of said spring pack, so as to glue a second spar onto said second lateral surface.
2 more elements
Dependencies are inferred from the claim text.