Cycling replacement blocks based on a die wafer location

A system for cycling a reserved block of a memory device comprising dies, a respective die of the dies including the replacement block, the system comprising:

• a processing device coupled to the memory device, the processing device to perform operations comprising:
• identifying a respective die of the dies as a high-risk die corresponding to a die of the memory device as most likely to experience a die failure during operation of the memory device based on die wafer location data;
• and
• cycling the reserved block of the high-risk die in response to the identifying.

A non-transitory computer-readable storage medium comprising instructions that, when executed by a processing device, cause the processing device to perform operations comprising:

• retrieving die wafer location data from a memory, the die wafer location data providing a die location failure value for each die of a memory device indicating a likelihood of die failure during operation of the memory device;
• identifying a die of the memory device as a high-risk die corresponding to a die of the memory device as most likely to experience a die failure during operation of the memory device based on the retrieved die wafer location data;
• identifying a reserved block of the high-risk die;
• and
• cycling the reserved block of the high-risk die.