Resin sealing apparatus, resin sealing method, and resin molding method

A resin sealing apparatus that seals a workpiece with a resin to process into a molded product using a sealing mold comprising an upper mold and a lower mold, the resin sealing apparatus comprising:

• a control part that controls a temperature of the sealing mold, wherein
• the control part is configured to:
• take, as a normal setting temperature, a temperature of the sealing mold set as a temperature for appropriately thermally curing the resin during sealing, and take, as a switching setting temperature, a temperature of the sealing mold set as a temperature higher than the normal setting temperature by a predetermined temperature, and
• in a unit process in which the workpiece and the resin are carried into the sealing mold, sealed, and then carried out as the molded product, with respect to at least one of the upper mold and the lower mold, change a setting temperature to increase from the normal setting temperature to the switching setting temperature at a predetermined start timing to control the temperature of the sealing mold, and change the setting temperature from the switching setting temperature to the normal setting temperature at a predetermined end timing to control the temperature of the sealing mold.