Manifold
AssigneeAisin Corporation
InventorsYoshikuni ITO, Kosuke OTSUKA
Life of this patent
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Abstract
A manifold includes: a high-temperature channel through which a high-temperature fluid flows; a low-temperature channel through which a low-temperature fluid having a lower temperature than the high-temperature fluid flows; and a manifold body having the high-temperature channel and the low-temperature channel. The high-temperature channel and the low-temperature channel are disposed close to each other. The manifold body has a thermal insulation space between the high-temperature channel and the low-temperature channel in a location where the high-temperature channel and the low-temperature channel are disposed close to each other.
Claims8
A manifold comprising:
- a high-temperature channel through which a high-temperature fluid flows;
- a low-temperature channel through which a low-temperature fluid having a lower temperature than the high-temperature fluid flows;
- and
- a manifold body having the high-temperature channel and the low-temperature channel, wherein
- the high-temperature channel and the low-temperature channel are disposed close to each other, and
- the manifold body has a thermal insulation space between the high-temperature channel and the low-temperature channel in a location where the high-temperature channel and the low-temperature channel are disposed close to each other.
Dependencies are inferred from the claim text.