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US 2026/0132734 A1Published application
Cooling module
AssigneeAisin Corporation
InventorsShinya OSUKA, Takashi KUROZUMI, Katsuhiro ISHIKAWA, Akihiro KATAOKA
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Abstract
There is provided a cooling module that enables a cooling liquid to efficiently circulate in a manifold. The cooling module includes a resin manifold having a coolant flow path through which a cooling fluid circulates, the manifold is formed by joining a first housing and a second housing, each of which includes three-dimensionally curved portion, and a bonded surface of the first housing and a bonded surface of the second housing include at least a part having a curved surface.
Claims6
A cooling module comprising
- a resin manifold having a coolant flow path through which a cooling fluid circulates, wherein
- the manifold is formed by joining a first housing and a second housing, each of which includes a three-dimensionally curved portion, and
- a bonded surface of the first housing and a bonded surface of the second housing include at least a part having a curved surface.
Dependencies are inferred from the claim text.