Electronic device including an outermost layer having oxide material, assembly structure and method of manufacturing the same

Abstract

An electronic device, an assembly structure and a manufacturing method are provided. The electronic device includes a base portion, a circuit structure, an insulation structure, a first conductive layer, a via structure, a first outer layer and a second outer layer. The circuit structure is disposed on a first surface of the base portion. The insulation structure is disposed on the circuit structure. The first conductive layer is disposed on the insulation structure. The via structure extends through the insulation structure, and electrically connects the first conductive layer and the circuit structure. The first outer layer is disposed on the first conductive layer. The second outer layer is disposed on the first outer layer. The second outer layer includes an oxide material so as to improve a coplanarity of an outermost surface of the second outer layer.

Dependencies are inferred from the claim text.