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US 2026/0123496 A1Published application
Substrate and manufacturing method for the same
AssigneeAbsolics Inc.
InventorsSungjin KIM, Jincheol KIM
Life of this patent
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Abstract
A substrate according to the present disclosure comprises a glass core having an upper surface. A maximum height roughness (Rmax) value of the upper surface of the glass core is 3 nm to 7 nm. A surface energy of the upper surface of the glass core is 50 mN/m to 63 mN/m. In such a case, an insulating layer having improved peel resistance may be implemented on the glass core, and electrical reliability of the substrate may be further improved.
Claims18
A substrate comprising:
- a glass core having an upper surface,
- wherein a maximum height roughness (Rmax) value of the upper surface of the glass core is 3 nm to 7 nm, and
- a surface energy of the upper surface of the glass core is 50 mN/m to 63 mN/m.
A substrate comprising:
- a glass core;
- and
- a first redistribution layer disposed on the glass core,
- wherein the first redistribution layer comprises a conductive layer and an insulating layer surrounding at least a portion of the conductive layer,
- wherein the first redistribution layer has an upper surface, and
- a waviness of the upper surface of the first redistribution layer is 0.7 μm or less.
3 more elements
A method of manufacturing a substrate, comprising:
- a preparation step of preparing a base glass plate;
- and
- a roughening step of forming a glass core by roughening an upper surface of the base glass plate,
- wherein the glass core has an upper surface,
- a maximum height roughness (Rmax) value of the upper surface of the glass core is 3 nm to 7 nm, and
- a surface energy of the upper surface of the glass core is 50 mN/m to 63 mN/m.
3 more elements
Dependencies are inferred from the claim text.