Methods for Substrate Bonding

A method of bonding a first substrate to a second substrate, comprising:

• treating a surface of a first portion of the first substrate to produce a treated first substrate having a treated first portion and a second portion, followed by
• contacting the surface of the treated first substrate with a surface of the second substrate under conditions sufficient to bond the treated first substrate with the second substrate;
• wherein a bonding speed of the treated first portion to the second substrate is greater than a bonding speed of the second portion of the treated first substrate to the second substrate.

A non-transitory computer readable medium, having instructions stored thereon which, when executed, cause a processing chamber to perform a method of processing a substrate, the method comprising:

• treating a surface of a first portion of the substrate to produce a treated substrate having a treated first portion and a second portion, wherein a bonding speed of the treated first portion to another substrate is different than a bonding speed of the second portion to the other substrate.