Data processing systems including optical communication modules

An apparatus comprising:

• a photonic integrated circuit (PIC) comprising a first surface and a second surface opposite the first surface, the photonic integrated circuit comprising at least one of an optical modulator or a photodetector;
• an electrical integrated circuit mounted on the first surface of the photonic integrated circuit;
• wherein the electrical integrated circuit comprises a serializers/deserializers (SerDes) that is directly or indirectly electrically connected to at least one of the optical modulator or the photodetector in the photonic integrated circuit;
• and
• a first fiber array connector part that is mounted to the first surface or the second surface of the photonic integrated circuit.

A method comprising:

• at a first fiber array connector part, receiving optical signals;
• at a photonic integrated circuit (PIC) comprising a photodetector, receiving the optical signals from the first fiber array connector part, and using the photodetector to convert the optical signals to electrical signals;
• wherein the photonic integrated circuit comprises a first surface and a second surface opposite the first surface;
• wherein the first fiber array connector part is coupled to the first surface or the second surface of the photonic integrated circuit;
• transmitting the electrical signals from the photonic integrated circuit to an electrical integrated circuit mounted on the first surface of the photonic integrated circuit;
• wherein the electrical integrated circuit comprises a serializers/deserializers (SerDes);
• and
• at the serializers/deserializers, conditioning the electrical signals received from the photonic integrated circuit.

A method comprising:

• at a serializers/deserializers, conditioning electrical signals received from an electrical integrated circuit, wherein the serializers/deserializers is part of an electrical integrated circuit mounted on a first surface of a photonic integrated circuit;
• wherein the photonic integrated circuit comprise the first surface and a second surface opposite the first surface;
• wherein the photonic integrated circuit comprises an optical modulator;
• at the photonic integrated circuit, receiving the electrical signals from the serializers/deserializers, using the optical modulator to convert the electrical signals to optical signals, and transmitting the optical signals to a first fiber array connector part mounted on the first surface or the second surface of the photonic integrated circuit.