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US 2026/0116773 A1Published application
Sintered body, method of fabricating the same, semiconductor fabricating device, and method of fabricating semiconductor fabricating device
AssigneeSamsung Electronics Co., Ltd.
InventorsChang Hwan KIM, Takafumi NOGUCHI, Toshihiro IIZUKA, Kenichi NAGAYAMA
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Abstract
A sintered body, a method of fabricating the sintered body, a semiconductor fabricating device, and a method of fabricating the semiconductor fabricating device, the sintered body including 50 mass % or more of Y5O4F7, wherein the sintered body has a relative density of 97.0% or more and a Vickers hardness of 2.4 GPa or more.
Claims7
A sintered body comprising 50 mass % or more of Y5O4F7, wherein the sintered body has a relative density of 97.0% or more and a Vickers hardness of 2.4 GPa or more.
Dependencies are inferred from the claim text.