Handling device and method for separating at least one workpiece from a residual grid of a residual grid assembly of parts

A handling device for separating a workpiece from a residual grid of a residual grid assembly of parts, which can be produced from a plate-shaped material by a cutting process, the handling device comprising:

• a support framework on which a rear-engagement device is provided which has rear-engagement elements that are configured to be moved relative to the support framework from a disengagement position into a gripping position in which the residual grid assembly of parts is engaged from behind;
• and
• a holder arranged on the support framework and comprising at least one holding element, by which the residual grid assembly of parts is configured to be transferred from the gripping position into a separating position in which the residual grid assembly of parts is lifted away from the rear-engagement elements,
• wherein the residual grid assembly of parts arranged in the separating position is configured to be subjected to vibrations from a vibration tool in order to separate the at least one workpiece from the residual grid.