Method for controlling semiconductor process environment
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHAO-MING CHANG, CHUN-LANG CHEN
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Abstract
A method for controlling the semiconductor process environment is provided. The method includes placing a cleaning member in a processing chamber of a semiconductor processing tool. The method also includes creating a vacuum in the processing chamber. Furthermore, the method includes eliminating at least one compound from the residues in the processing chamber by the cleaning member. The cleaning member is configured to facilitate physical adsorption, catalysis, or chemical reactions with the residues in the processing chamber.
Claims20
A cleaning member for use in a semiconductor processing tool, comprising:
- a base layer;
- and
- an exposure layer formed on the base layer, wherein the exposure layer is configured to interact with residues in an interior of the semiconductor processing tool or act as a catalyst to facilitate chemical reactions of the residues in the interior of the semiconductor processing tool.
A semiconductor processing tool, comprising:
- a processing chamber in which a semiconductor wafer is processed;
- and
- a cleaning member removably disposed in the processing chamber, wherein the cleaning member is configured to facilitate physical adsorption, catalysis, or chemical reactions with residues in the processing chamber.
A method, comprising:
- placing a cleaning member in a processing chamber of a semiconductor processing tool;
- and
- eliminating at least one compound from residues in the processing chamber by the cleaning member, wherein the cleaning member is configured to facilitate physical adsorption, catalysis, or chemical reactions with the residues in the processing chamber.
Dependencies are inferred from the claim text.