Heat pump apparatus
AssigneeMitsubishi Electric Corporation
InventorsNaofumi TAKENAKA, Takeshi HATOMURA, Yuki MIZUNO, Hirokuni SHIBA, Takashi OKAZAKI
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AssigneeMitsubishi Electric Corporation
InventorsNaofumi TAKENAKA, Takeshi HATOMURA, Yuki MIZUNO, Hirokuni SHIBA, Takashi OKAZAKI
Estimating the term…
A heat pump apparatus includes a heat source unit, a relay unit connected to the heat source unit, and a plurality of load units connected to the relay unit. The heat source unit includes a first refrigerant circuit in which refrigerant is circulated and a first water heat exchanger that exchanges heat with the first refrigerant circuit. The relay unit includes a second refrigerant circuit in which the refrigerant is circulated and a second water heat exchanger that exchanges heat with the second refrigerant circuit. The first water heat exchanger, the second water heat exchanger, and the load units are connected by first heat-medium pipe, wherein a first heat-medium circuit is formed in which a heat medium is circulated.
A heat pump apparatus comprising a heat source unit, a relay unit connected to the heat source unit, and a plurality of load units connected to the relay unit, wherein
Dependencies are inferred from the claim text.