Method of manufacturing microgasket for reconnectable implantable device

An apparatus comprising:

• at least one processor;
• and
• at least one memory storing instructions that, when executed by the at least on processor, cause the apparatus to:
• form a plurality of conductive elements on a surface of a substrate, the plurality of conductive elements arranged along a first direction parallel to the surface of the substrate and a second direction parallel to the surface of the substrate, wherein respective first height dimensions of respective conductive elements are parallel to a third direction;
• compress, in the third direction, the plurality of conductive elements using a planar component, wherein the compressing adjusts the respective first height dimensions to respective second height dimensions;
• inject a dielectric material between the substrate and the planar component, wherein injecting the dielectric material forms a dielectric layer around and in contact with the plurality of conductive elements;
• and
• remove the substrate and the planar component.

An apparatus comprising:

• an enclosure component comprising a cavity for a plurality of electronic components, wherein (i) a height of the enclosure component is parallel to a first direction, (ii) a width of the enclosure component is parallel to a second direction, and (iii) a depth of the enclosure component is parallel to a third direction;
• a header in contact with the enclosure component, the header comprising a first plurality of cavities extending through the header in the first direction;
• a first plurality of conductive elements formed in the first plurality of cavities, wherein one or more electronic components of the plurality of electronic components are electrically coupled with one or more conductive elements of the first plurality of conductive elements;
• a gasket in contact with a top surface of the header with respect to the first direction, the gasket comprising a second plurality of cavities extending through the gasket in the first direction;
• a second plurality of conductive elements formed in the second plurality of cavities, wherein the second plurality of conductive elements are in contact with the first plurality of conductive elements;
• and
• an interface component in contact with a top surface of the gasket with respect to the first direction, the interface component comprising a plurality of contact pads in contact with the second plurality of conductive elements.