Method of forming a bonded structure
AssigneeLockheed Martin Corporation
InventorsFelix Nhanchau Nguyen, Yin-Farn Chen, William P. Fallon, Robert Warner Koon
Life of this patent
Estimating the term…
Abstract
A method of forming a bonded structure is disclosed herein. In some embodiments, a method includes curing a first part on a first tool to a first degree of cure, the first degree of cure (DOC) being a partially cured state, removing the partially cured first part from the first tool, assembling the partially cured first part and a second part into a structure, and curing the structure to form a bonded structure, where the partially cured first part is cured to a second degree of cure (DOC) that is greater than the first DOC.
Claims20
A method of forming a bonded structure, comprising:
- curing a first part on a first tool to a first degree of cure, wherein the first degree of cure (DOC) being a partially cured state;
- removing the partially cured first part from the first tool;
- assembling the partially cured first part and a second part into a structure;
- and
- curing the structure to form a bonded structure, wherein the partially cured first part is cured to a second degree of cure (DOC),
- wherein the second DOC is greater than the first DOC.
Dependencies are inferred from the claim text.