Method of manufacturing wafer cleaning brush

A method of manufacturing a wafer cleaning brush, the method comprising:

• providing a polyvinyl alcohol (PVA) solution;
• adding a water-soluble inorganic compound comprising a plurality of particles and an acetone-based material to the PVA solution, and mixing the PVA solution, the water-soluble inorganic compound, and the acetone-based material to form a mixture of the PVA solution, the water-soluble inorganic compound, and the acetone-based material;
• adding formaldehyde to the mixture of the PVA solution, the water-soluble inorganic compound, and the acetone-based material to form an insoluble polyvinyl fluoride (PVF) and to form a mixture of the water-soluble inorganic compound, the acetone-based material and the insoluble PVF;
• forming a wafer cleaning brush by inserting the mixture of the water-soluble inorganic compound, the acetone-based material, and the insoluble PVF into a mold, and heat-treating the mixture;
• removing the wafer cleaning brush from the mold;
• and
• washing the wafer cleaning brush to remove the plurality of particles of the water-soluble inorganic compound from the wafer cleaning brush.

A method of manufacturing a wafer cleaning brush, the method comprising:

• providing a polyvinyl alcohol (PVA) solution;
• forming an insoluble polyvinyl fluoride (PVF) by adding formaldehyde and a catalyst to the PVA solution and crosslinking the PVA solution with the formaldehyde by the catalyst;
• adding a water-soluble inorganic compound comprising a plurality of particles to the insoluble PVF and mixing the insoluble PVF with the water-soluble inorganic compound to disperse the water-soluble inorganic compound in the insoluble PVF;
• forming a wafer cleaning brush by inserting a mixture of the water-soluble inorganic compound and the insoluble PVF into a mold and heat-treating the mixture;
• removing the wafer cleaning brush from the mold;
• and forming a plurality of pores by washing the wafer cleaning brush to remove the plurality of particles of the water-soluble inorganic compound from the wafer cleaning brush.