Semiconductor packages and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHung-Min Chang, Chien-Chang Lin, Hsuan-Cheng Kuo, Shih-Hui Wang, Tzu-Shiun Sheu
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a board substrate, an integrated circuit component and a ring structure. The integrated circuit component is bonded to the board substrate and includes at least one semiconductor die. The ring structure is disposed on the board substrate and encircles the integrated circuit component, wherein the ring structure includes a plurality of cavities around a boundary of the integrated circuit component.
Claims19
A semiconductor package, comprising;
- a board substrate;
- an integrated circuit component, bonded to the board substrate and comprising at least one semiconductor die;
- and
- a ring structure, disposed on the board substrate and encircling the integrated circuit component, wherein the ring structure comprises a plurality of cavities around a boundary of the integrated circuit component.
A semiconductor package, comprising;
- a board substrate;
- an integrated circuit component, bonded to the board substrate and comprising at least one semiconductor die;
- a ring structure, disposed on the board substrate and encircling the integrated circuit component, wherein the ring structure comprises first portions and second portions thicker than the first portions;
- and
- a cover member, disposed on the ring structure and the integrated circuit component.
A method of forming a semiconductor package, comprising:
- bonding an integrated circuit component to a board substrate, wherein the integrated circuit component comprises at least one semiconductor die;
- forming an underfill layer between the integrated circuit component and the board substrate;
- and
- attaching a ring structure to the board substrate, wherein the ring structure encircles the integrated circuit component, and comprises a plurality of cavities around a boundary of the integrated circuit component.
Dependencies are inferred from the claim text.