Semiconductor package

A semiconductor package comprising:

• a package substrate;
• a mediate substrate on the package substrate and including an active layer and a wiring layer;
• a first semiconductor device on the mediate substrate;
• and
• a second semiconductor device adjacent to the first semiconductor device and on the mediate substrate, wherein
• the wiring layer includes path wirings configured to connect the first semiconductor device and the second semiconductor device to each other, the path wirings including n paths (n is an integer that is 2 or more),
• the active layer includes a demultiplexer (DEMUX) connected to the first semiconductor device and a multiplexer (MUX) connected to the second semiconductor device, and
• one of the n paths is selected through the DEMUX and the MUX, the selected path having an impedance from a range of impedances.

A semiconductor package comprising:

• a package substrate;
• at least two semiconductor devices on the package substrate;
• and
• a path substrate including path wirings and a selection circuit, the path wirings connecting the at least two semiconductor devices to each other, the path wirings including n paths (n is an integer that is 2 or more) and the selection circuit configured to select one of the n paths,
• wherein the semiconductor package has an impedance from a range of impedances, the range of impedances being based on path selection by the selection circuit.