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US 2026/0107834 A1Published application
Semiconductor module including a backside capacitor, package structure including the semiconductor module and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChieh-Lung LAI, Meng-Liang LIN, Hsien-Wei CHEN, Kathy YAN
Life of this patent
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Abstract
A semiconductor module includes an interposer, a plurality of semiconductor dies on the interposer, wherein each semiconductor die of the plurality of semiconductor dies has a frontside surface facing the interposer and a backside surface opposite to the interposer, and a backside capacitor on the backside surface of at least one of the plurality of semiconductor dies and electrically coupled to the interposer.
Claims20
A semiconductor module, comprising:
- an interposer;
- a plurality of semiconductor dies on the interposer, wherein each semiconductor die of the plurality of semiconductor dies has a frontside surface facing the interposer and a backside surface opposite to the interposer;
- and
- a backside capacitor on the backside surface of at least one of the plurality of semiconductor dies and electrically coupled to the interposer.
1 more element
A method of making a semiconductor module, the method comprising:
- forming an interposer;
- attaching a plurality of semiconductor dies to the interposer, wherein each semiconductor die of the plurality of semiconductor dies has a frontside surface facing the interposer and a backside surface opposite to the interposer;
- forming an upper molding layer around the plurality of semiconductor dies;
- and
- forming a backside capacitor on the backside surface of at least one of the plurality of semiconductor dies and the upper molding layer, such that the backside capacitor is electrically coupled to the interposer through the upper molding layer.
2 more elements
A package structure, comprising:
- a package substrate;
- a semiconductor module on the package substrate, comprising:
- an interposer;
- a plurality of semiconductor dies on the interposer;
- and
- a backside capacitor on the plurality of semiconductor dies and electrically coupled to the interposer, wherein the backside capacitor comprises a passivation film and a pair of parallel metal films in the passivation film;
- a thermal interface material on the backside capacitor and contacting the passivation film, wherein the pair of parallel metal films are between the plurality of semiconductor dies and the thermal interface material;
- and
- a package lid on the thermal interface material and attached to the package substrate.
6 more elements
Dependencies are inferred from the claim text.